When the product loses the specified function, it is defined to be invalid. The process of failure analysis is to analysis and verify the failure according to the failure mode and phenomenon, simulate the failure situation and excavate its failure mechanism. It’s the process that looking for the physical or chemical processes that lead to the failure of parts, components and materials. The final goal is to analyze the failure mechanism by confirming the failure mode, clarify the failure causes, and give preventive countermeasures to reduce or avoid the recurrence of failure.
Principle of failure analysis: non destructive analysis shall be carried out first, followed by destructive analysis; First carry out external analysis, then internal (anatomical) analysis; First investigate and understand the conditions related to failure (application conditions, failure phenomena, etc.), and then analyze the failed devices.
Category | Analytical method | Details & Purpose |
---|---|---|
Nondestructive Analysis | Electrical Analysis | The integrated testing machine is used to detect the electrical parameters of the chip, determine the type of data abnormality, and then determine the chip state. |
X-ray Analysis | Use the image obtained by X-ray to check the bonding line, chip connection, lead frame, gap, etc., and determine the failure point. | |
I-V Analysis | Measure the semiconductor parameters of MOS, BJT or IC and compare them with good products to determine the difference range. | |
OMs | Observe whether there are defects on the surface of the device. | |
Thermal EMMI | Detect whether the leakage is uniform, find out the position with large local leakage, and analyze the defects directionally. | |
OBIRCH | ||
Destructive analysis | Decap Analysis | Remove the protective layer of the chip shell by chemical or physical methods, expose the chip, and determine the bonding defects of the chip or lead. |
Cratering Testing | Check whether the first solder joint of the welding line causes damage to the structure of each layer below the chip metal layer. | |
Delayer | Observe whether the lower layer of the device is abnormal. | |
SEM/EDX | With larger magnification, the sample surface or section structure can be clearly observed; And analyze the element composition of the surface. | |
FIB | Local fixed-point samples can be excavated to observe the structure and morphology of the device at the defect. |